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Ceramic Dispensing Nozzle Manufacturer & Supplier - JiFeng Ceramics

Ceramic Nozzle/

Ceramic Dispensing Nozzle

Our ceramic dispensing nozzles are made of high‑purity 99% alumina (Al₂O₃) or Y‑TZP zirconia (ZrO₂) ceramic. Inner diameter ranges from 0.01–2mm, surface finish Ra ≤0.1μm, designed for precision dispensing processes. With hardness ≥Hv1500, chemical resistance to solvents (acetone, alcohol, epoxy, etc.), and zero metal ion contamination, they are ideal for semiconductor packaging, LED die bonding, medical catheter bonding, and more. They solve common issues with metal or plastic nozzles: uneven dispensing, stringing, clogging, wear, and swelling.

  • Product Details
  • Technical Specifications

Core Advantages 

✅ Nano‑Scale Dispensing Precision

Micro‑hole precision machining: Laser drilling + mirror inner polishing (Ra ≤0.05μm), hole tolerance ±0.003mm. Supports ultra‑micro dispensing at 0.01ml/min with ±1% accuracy.

Non‑stick inner wall: Low surface energy reduces adhesive residue, prevents UV glue/silicone curing and clogging. Continuous service life >1000 hours.

✅ Extreme Durability

Wear & erosion resistance: Hardness 8× that of stainless steel. Resists high‑viscosity conductive glue with glass/silver powder; service life 10× longer.

Chemical resistance: Withstands strong acid (phosphoric acid), alkali (IPA), and 180°C high‑temp adhesive. No swelling or deformation for long‑term stability.

✅ Versatile & Compatible Design

Optimized tapered flow channel: 15°/30°/60° taper options for all fluid viscosities (water‑like UV glue to paste epoxy), reduces bubbles and turbulence.

Universal quick‑fit compatibility: Works with Nordson EFD, Musashi, I&J, and other leading dispensers (thread / snap / Luer lock), plug‑and‑play.

✅ Clean & Contamination‑Free

Medical‑grade safety: ISO 10993 biocompatibility certified, no particle shedding, suitable for medical catheter bonding and microfluidic chip packaging.

Non‑magnetic & insulating: No interference with precision electronics, ideal for magnetic levitation dispensers and high‑sensitivity sensor production.

 

Applications 

Semiconductor chip packaging 

LED die bonding

Medical device assembly & catheter bonding

Microfluidic chip packaging 

SMT & electronic assembly 

High‑precision adhesive dispensing 

 

Custom Service

Custom inner diameter, length, taper angle 

Custom interface (thread, Luer lock, snap‑fit) 

Drawing customization & sample approval

Fast quotation & short lead time 

Performance ItemDetails
Material99% Al₂O₃ (standard), YTZP ZrO₂ (high toughness)
Inner Diameter0.01–2mm (micro/standard/highflow)
Temperature Range-40°C to 300°C (transient 500°C)
Bending Strength≥400MPa (Al₂O₃); ≥1200MPa (ZrO₂)
CertificationsIPC JSTD004, ISO 13485

 

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