吉峰陶磁器
Precision is non-negotiable in semiconductor manufacturing. したがって, you need reliable equipment. 具体的には, Jifeng Ceramics manufactures advanced Alumina Ceramic End Effector solutions. These are also known as robotic arms or wafer forks. さらに, they are designed to meet the stringent requirements of front-end wafer fabrication.
The Alumina Ceramic End Effector acts as a critical interface. It sits between the robot and the silicon wafer. その結果, it provides exceptional stability. さらに, it offers high thermal shock resistance. Unlike aluminum or PEEK, our high-purity alumina ceramics (99.5% Al2O3) eliminate contamination. As a result, they ensure the integrity of 300mm wafers in vacuum environments.
In conclusion, Jifeng Ceramics offers both standard and custom solutions. Do you need a prototype? Then, contact our engineering team today.
Why Top Fabs Switch to Alumina Ceramic Arms
The transition from metal to advanced ceramics in wafer handling is driven by the physics of semiconductor processing.
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Unmatched Stiffness-to-Weight Ratio: With a Young’s Modulus of approximately 370 GPa , alumina is nearly 5 times stiffer than aluminum. This high rigidity prevents the “droop” or deflection of the arm end when loaded with a heavy 300mm wafer, ensuring precise placement into cassettes and process chambers without vibration or positional errors.
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Extreme Temperature Capability: Our alumina arms maintain their mechanical integrity at temperatures up to 1600℃. This makes them indispensable for Rapid Thermal Processing (RTP) そして Chemical Vapor Deposition (CVD) furnaces, where metal arms would warp, fatigue, or introduce metallic contamination.
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Plasma & Chemical Resistance: In dry etching chambers, process gases like fluorine and chlorine plasmas aggressively attack metals. High-purity alumina is chemically inert, extending the lifespan of the end effector and significantly reducing particle generation.
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Electrical Insulation & 絶縁耐力: For processes involving RF plasma or high voltages, alumina acts as an excellent electrical insulator (体積抵抗率 > 10¹⁴ Ω·cm), preventing arcing and protecting sensitive wafer circuitry.
Advanced Technical Features of Jifeng Ceramic Arms
We leverage state-of-the-art CNC machining and sintering technologies to deliver features that enhance process yield.
1. Integrated Vacuum Channels (No Adhesives) Using our proprietary bonding and machining technology, we create internal vacuum channels within the ceramic body without using organic adhesives or glues that could outgas in a vacuum. This monolithic-like structure ensures a robust vacuum seal for secure wafer gripping.
2. Pore-Free Contact Surfaces The contact pads of our end effectors are diamond-polished to a surface roughness of Ra < 0.2µm. This mirror-like finish minimizes friction and prevents the generation of backside particles on the wafer, a critical factor in maintaining lithography depth-of-focus.
3. ESD-Safe Material Options Static electricity can destroy sensitive device structures. We offer ESD-Safe Alumina variants (dissipative ceramics) with a tuned resistivity range (typically 10⁵ to 10⁹ Ω·cm) to safely bleed off static charges from the wafer upon contact, preventing electrostatic discharge (ESD) events.
4. Lightweight & Optimised Geometries Through Finite Element Analysis (FEA), we optimize the rib structure and hollow out non-structural areas to reduce the mass of the arm. This reduces the inertia load on the robot’s drive motors, allowing for faster acceleration/deceleration and higher throughput.
Technical Specifications & Customization
Do you need specific dimensions? Then, check our capabilities below.
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材料: 99.5% – 99.9% High Purity Alumina.
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Tolerance: Up to ±0.005mm.
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Customization: さらに, we accept custom drawings.
