JiFeng Ceramics
Core Advantages
✅ Controllable Conductivity
Carbon/metal phase doping enables adjustable surface resistance from 10³–10¹⁰Ω, preventing electrostatic particle adsorption.
✅ Ultra‑High Precision
CNC machining tolerance ±0.002mm, surface roughness Ra≤0.05μm, suitable for nanometer processes.
✅ Plasma Corrosion Resistance
Corrosion rate <0.1μm/100h in fluorine/chlorine plasma environment; service life increased by 5×+.
✅ Ultra‑High Cleanliness
No metal ion leaching; passes SEMI F47 particle shedding test (≤5 pcs/sheet @0.3μm).✅ Complex Structure Forming
Supports injection molding / 3D printing; thin‑wall (≥0.2mm), special‑shaped, and porous structures available.
Applications
Semiconductor Frontend
Etching: chamber liners, gas nozzles, wafer chucks
Deposition (PVD/CVD): shield rings, bases, heater trays
Lithography: mask holders, aligner parts
Display & Packaging
OLED evaporation: light shields, robot grippers
Probe stations: ceramic substrates, test sockets
Advanced packaging: TSV insulation rings, RDL brackets
PV & Electronics
PV coating: conductive rollers, guide rails
High‑power devices: IGBT substrates, RF microwave windows
Why Choose Us?
Advanced material: reaction sintering + HIP, 99.5% density, uniform conductive phase.
DLC coating: friction coefficient 0.1, wear resistance ×8.
Strict QC: 100% helium leak test, X‑ray inspection.
Fast delivery: standard 7 days, custom 15 days, urgent 72h.
Global support: FEA simulation, failure analysis, equipment adaptation.
