Typical Applications of Alumina Ceramic Pump Core
Semiconductor Wet Processing Equipment
- Etchant Transfer Pump: Laminar/turbulent flow control; flow fluctuation < ±1.5%; HF/HNO₃ resistant; ion contamination < 0.1 ppb.
- CMP Slurry Circulation Pump: Nano‑finished surface (Ра ≤ 0.05 мкм); resists abrasive particles; срок службы > 20,000 часы.
New Energy Sector
- Fuel Cell Hydrogen Recirculation Pump: Zero hydrogen embrittlement; hydrogen permeability < 1×10⁻¹⁰ mol/(m²·s·Pa); optional Pt/Ru conductive coating.
- Sodium-Sulfur Battery Molten Salt Pump: Resists 400°C molten sulfur & liquid sodium; thermal shock resistant (ΔT=800°C→room temp, 50 cycles no cracking).
Special Industrial Systems
- High-Temperature Molten Salt Heat Transfer Pump: Resists 600°C nitrate/chloride molten salt; низкое тепловое расширение (6.5×10⁻⁶/°С).
- Nuclear Waste Treatment Pump: Gamma radiation resistant (>10⁶ Ги); zero radioactive adsorption; decontamination factor > 10³.
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Precision Adapted Design
Flow field simulation (ANSYS Fluent); Al₂O₃-ZrO₂ composite toughening (трещиностойкость до 8 МПа·м¹ᐟ²).
Передовое производство
Micro-pore grouting (мин. flow width 0.2 мм, tolerance ±0.01 mm); atmosphere sintering (O₂ < 5 ppm).
Полный контроль качества процесса
Helium leak detection (sensitivity 10⁻¹² Pa·m³/s); particle counting (Класс ИСО 4 cleanroom standard).
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