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Ceramic Dispensing Nozzle Manufacturer & Поставщик - Цзифэн Керамика

Керамическая насадка/

Ceramic Dispensing Nozzle

Our ceramic dispensing nozzles are made of high‑purity 99% глинозем (Al₂O₃) or Y‑TZP zirconia (ZrO₂) керамический. Inner diameter ranges from 0.01–2mm, surface finish Ra ≤0.1μm, designed for precision dispensing processes. With hardness ≥Hv1500, chemical resistance to solvents (acetone, alcohol, epoxy, и т. д.), and zero metal ion contamination, they are ideal for semiconductor packaging, LED die bonding, medical catheter bonding, and more. They solve common issues with metal or plastic nozzles: uneven dispensing, stringing, clogging, носить, and swelling.

  • Подробная информация о продукте
  • Технические характеристики

Основные преимущества

✅ Nano‑Scale Dispensing Precision

Micro‑hole precision machining: Laser drilling + mirror inner polishing (Ra ≤0.05μm), hole tolerance ±0.003mm. Supports ultra‑micro dispensing at 0.01ml/min with ±1% accuracy.

Non‑stick inner wall: Low surface energy reduces adhesive residue, prevents UV glue/silicone curing and clogging. Continuous service life >1000 часы.

✅ Extreme Durability

Носить & erosion resistance: Hardness 8× that of stainless steel. Resists high‑viscosity conductive glue with glass/silver powder; service life 10× longer.

Chemical resistance: Withstands strong acid (phosphoric acid), alkali (IPA), and 180°C high‑temp adhesive. No swelling or deformation for long‑term stability.

✅ Versatile & Compatible Design

Optimized tapered flow channel: 15°/30°/60° taper options for all fluid viscosities (water‑like UV glue to paste epoxy), reduces bubbles and turbulence.

Universal quick‑fit compatibility: Works with Nordson EFD, Musashi, я&J, and other leading dispensers (thread / snap / Luer lock), plug‑and‑play.

✅ Clean & Contamination‑Free

Medical‑grade safety: ISO 10993 biocompatibility certified, no particle shedding, suitable for medical catheter bonding and microfluidic chip packaging.

Non‑magnetic & insulating: No interference with precision electronics, ideal for magnetic levitation dispensers and high‑sensitivity sensor production.

Приложения

Semiconductor chip packaging

LED die bonding

Medical device assembly & catheter bonding

Microfluidic chip packaging

SMT & electronic assembly

High‑precision adhesive dispensing

Custom Service

Custom inner diameter, length, taper angle

Custom interface (thread, Luer lock, snap‑fit)

Drawing customization & sample approval

Fast quotation & short lead time

Performance ItemDetails
Материал99% Al₂O₃ (стандартный), YTZP ZrO₂ (high toughness)
Inner Diameter0.01–2mm (micro/standard/highflow)
Температурный диапазон-40°C to 300°C (transient 500°C)
прочность на изгиб≥400MPa (Al₂O₃); ≥1200MPa (ZrO₂)
CertificationsIPC JSTD004, ISO 13485

 

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