Technical Advantages
Nanoscale Precision Machining
Adopts isostatic pressing + laser precision machining; tolerance ±0.005mm, surface roughness Ra≤0.1μm, suitable for ultra-precision instruments.
Extreme Environment Reliability
Materials include Al₂O₃, Si₃N₄, SiC; withstands 1800°C high temperature, strong acid/alkali, high vacuum; service life ×5–10.
Lightweight & Functional Integration
Density 1/3–1/2 of steel; supports integrated forming of complex shapes; conductive/insulating/thermal coatings available.
Core Applications
Semi-conducteur: Wafer handling arms, vacuum chamber guides, etcher insulation nozzles
Médical: Surgical robot joints, MRI non-magnetic parts, dental implant abutments
New Energy: Fuel cell bipolar plates, Li-ion battery sintering molds, PV corrosion-resistant brackets
Optical: Laser reflector cavities, fiber optic connector precision sleeves
Manufacturing Strength
Full-process Precision Control
From powder purification to sintering, grinding, inspection; CNC + CMM; ISO 2768-mK compliant.
Non-standard Customization
Complex parts: porous, micro-channel, thin-wall (≥0.3mm); metal-ceramic bonding, gradient materials.
Fast Response
12,000 ㎡ digital factory; 3–7 days prototype; 10–20 days small batch (≤5000 pcs).
Céramique JiFeng


















