Key Manufacturing Technologies
- Precision Forming & Thread Machining
Изостатическое прессование
Minimum size: M1.0×3 mm (hex socket / cross / slotted head customizable)
Thread accuracy: ISO 4H (zero‑clearance fit with metal nuts)
Laser‑Assisted Machining
Fine thread: pitch 0.25 мм, thread depth >0.5 мм (depth‑to‑diameter 5:1)
Anti‑slip serrated thread (pull‑out force +50%)
- Material Toughening & Обработка поверхности
Toughening Modification
3% Y₂O₃‑stabilized ZrO₂; fracture toughness up to 5.5 MPa·m¹ᐟ²
Surface Coatings
TiN coating: hardness HV2200, wear life ×8
Conductive Ni/Au coating: surface resistance <0.1 Ω·cm² for EMI shielding
Key Applications & Solutions
- Полупроводник & Vacuum Equipment
- Wafer Handling Fasteners
Low outgassing <5×10⁻¹⁰ Torr·L/s/cm²; UHV compatible (<10⁻⁸ Pa)
Static dissipative (10⁶–10⁹ Ω) to prevent particle adhesion
- Plasma Chamber Mounting
Resists Cl₂/CF₄ plasma (etch rate <0.05 μm/h)
Pre‑embedded FKM gasket (sealing pressure >10 МПа)
- New Energy & High-Temp Equipment
- Fuel Cell Bipolar Plate Fasteners
Hydrogen‑embrittlement resistant (preload loss <5% after 1000 thermal cycles)
Conductive coating: contact resistance <2 mΩ·cm²
- Lithium Battery Sintering Furnace
Softening temp >1700°С; superior creep resistance vs metal bolts
Thermal shock: ΔT=1000°C air cooling >100 cycles
- Медицинский & Optical Instruments
- MRI Non‑Magnetic Fasteners
Magnetic susceptibility <10⁻⁵; no imaging interference
ISO 10993‑5 biocompatibility certified
- Laser Module Assembly
CTE 6.5×10⁻⁶/°C (matches Mo/Kovar)
Low thermal conductivity (30 ж/(м·К)) reduces thermal interference
Цзифэн Керамика













