Semiconductor Ceramic Structural Components

Цирконий, стабилизированный иттрием (Ю-ТЗП) ceramic structural components and accessories are made from nano-scale zirconia powder via isostatic pressing and high-temperature sintering. With ultra-high strength, extreme environment resistance, biocompatibility and ultra-precision machining capabilities, they are widely used in semiconductor, медицинский, new energy, automotive and high-temperature industrial equipment.

Material Properties & Основные преимущества

Ultra-high strength: Bending strength ≥900MPa, fracture toughness 9.1MPa·m¹ᐟ², износостойкость >10 times that of metal (GB/T 41500-2022).

Extreme environment resistance: Melting point 2715°C, long-term heat resistance 800°C, thermal shock resistance ΔT≥280°C.

Биосовместимость: ISO 13485 / FDA certified, surface roughness Ra≤0.02μm, for artificial joints & sterile valves.

Precision machining: Tolerance ±0.005mm, supports special-shaped parts, micro-holes (≥0.2mm) and complex surfaces.

• Material Density: 5.89–6.05 g/cm³ (Y-TZP Цирконий)
• Диапазон размеров: φ0.2 mm to 300 мм, supporting complex geometries and micro-scale features
• Mechanical Performance: Bending strength ≥ 900 МПа, delivering exceptional structural integrity and wear resistance
• Certifications: ISO 13356 (Medical Implant Standard), ISO 9001 quality system, and FDA compliance for medical-grade applications