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Black Zirconia Ceramic Structural Components - Цзифэн Керамика

Керамические структурные компоненты/

Керамические структурные компоненты из черного циркония для полупроводников

Black Zirconia Ceramic Structural Components for Semiconductor are high-performance functional ceramic parts based on nano‑zirconia (ZrO₂), made via doping modification, прецизионная обработка, and surface treatment.

Designed specifically for semiconductor manufacturing, display panels, and photovoltaic equipment, they feature high hardness (≥1200HV), antistatic performance (surface resistance 10⁴–10⁶Ω), plasma corrosion resistance, and ultra‑low outgassing. They replace traditional alumina ceramics and metals to meet the strict requirements for cleanliness, precision, and reliability in semiconductor equipment.

  • Подробная информация о продукте
  • Технические характеристики

Core Advantages Of Керамические структурные компоненты из черного циркония для полупроводников

Controllable Conductivity

Carbon/metal phase doping enables adjustable surface resistance from 10³–10¹⁰Ω, preventing electrostatic particle adsorption.

Ultra‑High Precision

CNC machining tolerance ±0.002mm, surface roughness Ra≤0.05μm, suitable for nanometer processes.

Plasma Corrosion Resistance

Corrosion rate <0.1μm/100h in fluorine/chlorine plasma environment; service life increased by 5×+.

Ultra‑High Cleanliness

Отсутствие выщелачивания ионов металлов; passes SEMI F47 particle shedding test (≤5 pcs/sheet @0.3μm).

Complex Structure Forming

Supports injection molding / 3Д-печать; thin‑wall (≥0.2mm), special‑shaped, and porous structures available.

Applications of Керамические структурные компоненты из черного циркония для полупроводников

Semiconductor Frontend

  • Etching: chamber liners, gas nozzles, wafer chucks
  • Deposition (PVD/CVD): shield rings, bases, heater trays
  • Lithography: mask holders, aligner parts

Display & Packaging

  • OLED evaporation: light shields, robot grippers
  • Probe stations: ceramic substrates, test sockets
  • Advanced packaging: TSV insulation rings, RDL brackets

PV & Электроника

  • PV coating: conductive rollers, guide rails
  • High‑power devices: IGBT substrates, RF microwave windows

Why Choose Our Black Zirconia Structural Components?

Innovative Material Technology

Advanced material: reaction sintering + БЕДРО, 99.5% density, uniform conductive phase. DLC coating: friction coefficient 0.1, wear resistance ×8.

Full-Process Quality Control

All items undergo helium leak testing (leak rate <5×10⁻¹⁰ Pa·m³/s) & X-ray inspection (≤10μm). SEM/EDS and plasma corrosion test reports are provided.

Fast Response System

15-day lead time for standard parts, 30 days for customized non-standard parts; rush orders available upon technical evaluation.

Global Technical Support

We provide FEA simulation optimization, failure analysis and equipment adaptation modification services.

ПараметрDetails
МатериалYttria-stabilized zirconia (3Y/5Y-ZrO₂), black conductive zirconia (carbon/metal doped)
Плотность6.0–6.2 g/cm³
Твердость1200–1400 HV
прочность на изгиб≥1000 MPa (3-point bending)
Коэффициент теплового расширения10.5×10⁻⁶/°C (20–400°C, matches stainless steel)
Surface Resistance10³–10¹⁰ Ω (настраиваемый)
Диапазон размеровMax 300×300×150mm, thickness 0.2–50mm
СертификатыSEMI S2/S8, ИСО 14644-1 Сорт 1, RoHS, UL 94 В-0

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