JiFeng-Keramik
Key Manufacturing Technologies
1. Precision Forming & Thread Machining
Isostatisches Pressen
- Minimum size: M1.0×3 mm (hex socket / cross / slotted head customizable)
- Thread accuracy: ISO 4H (zero‑clearance fit with metal nuts)
Laser‑Assisted Machining
- Fine thread: pitch 0.25 mm, thread depth >0.5 mm (depth‑to‑diameter 5:1)
- Anti‑slip serrated thread (pull‑out force +50%)
2. Material Toughening & Oberflächenbehandlung
Toughening Modification
- 3% Y₂O₃‑stabilized ZrO₂; fracture toughness up to 5.5 MPa·m¹ᐟ²
Surface Coatings
- TiN coating: hardness HV2200, wear life ×8
- Conductive Ni/Au coating: surface resistance <0.1 Ω·cm² for EMI shielding
Key Applications of Alumina Ceramic Screws
1. Halbleiter & Vacuum Equipment
Wafer Handling Fasteners
- Low outgassing <5×10⁻¹⁰ Torr·L/s/cm²; UHV compatible (<10⁻⁸ Pa)
- Static dissipative (10⁶–10⁹ Ω) to prevent particle adhesion
Plasma Chamber Mounting
- Resists Cl₂/CF₄ plasma (etch rate <0.05 μm/h)
- Pre‑embedded FKM gasket (sealing pressure >10 MPa)
2. New Energy & High-Temp Equipment
Fuel Cell Bipolar Plate Fasteners
- Hydrogen‑embrittlement resistant (preload loss <5% after 1000 thermal cycles)
- Conductive coating: contact resistance <2 mΩ·cm²
Lithium Battery Sintering Furnace
- Softening temp >1700°C; superior creep resistance vs metal bolts
- Thermal shock: ΔT=1000°C air cooling >100 cycles
3. Medizinisch & Optical Instruments
MRI Non‑Magnetic Fasteners
- Magnetic susceptibility <10⁻⁵; no imaging interference
- ISO 10993‑5 biocompatibility certified
Laser Module Assembly
- CTE 6.5×10⁻⁶/°C (matches Mo/Kovar)
- Low thermal conductivity (30 W/(m·K)) reduces thermal interference
