JiFeng-Keramik
Core Performance Parameters
| Artikel | Value | Advantages vs Metal Parts |
| Temperature Resistance | Continuous working: 1600°C | 100% higher than stainless steel (800°C) |
| Druckfestigkeit | 4500 MPa | 10× aluminum alloy; 5× titanium alloy |
| Korrosionsbeständigkeit | Resists 98% H₂SO₄ / 40% NaOH (1000h no corrosion) | No electrochemical corrosion; service life extended 5–8 years |
| Insulation | Volume resistivity >10¹⁴ Ω·cm | Breakdown voltage 30 kV/mm; ideal for high-voltage equipment |
Typische Anwendungen & Solutions
1.Semiconductor Equipment
Vacuum Chamber Insulator Pillar
- Multi‑stage design matches chamber flange; thermal expansion difference <0.01 mm/100°C.
- Mo‑Mn metallization enables hermetic ceramic‑metal sealing.
Plasma Etcher Gas Distributor
- Precision holes ensure uniform gas flow (fluctuation <±3%).
- Resists CF₄/Cl₂ plasma; service life >30,000 Std..
2. New Energy Equipment
Fuel Cell Bipolar Plate Connector
- Custom conductive coating (Pt/Ni); contact resistance <5 mΩ·cm².
- Hydrogen permeability <1×10⁻¹⁰ mol/(m²·s·Pa).
Lithium Battery Sintering Furnace Setter
- Softening temperature >1700°C (no deformation under 20 kg load).
- Multi‑layer stacking improves yield by 15%.
3. Optical & Medizinische Geräte
Laser Resonator Support Pillar
- Thermal conductivity: 30 W/(m·K); temperature control ±0.1°C.
- Low CTE ensures wavelength stability (Δλ/λ <10⁻⁶/°C).
CT X‑ray Tube Insulator Base
- Lead glass composite; ray shielding >95%.
- Biocompatibility certified (ISO 10993‑5).
