Typische Anwendungen & Solutions
1.Semiconductor Equipment
l Vacuum Chamber Insulator Pillar
Multi‑stage design matches chamber flange; thermal expansion difference <0.01 mm/100°C.
Mo‑Mn metallization enables hermetic ceramic‑metal sealing.
l Plasma Etcher Gas Distributor
Precision holes ensure uniform gas flow (fluctuation <±3%).
Resists CF₄/Cl₂ plasma; service life >30,000 Std..
2. New Energy Equipment
l Fuel Cell Bipolar Plate Connector
Custom conductive coating (Pt/Ni); contact resistance <5 mΩ·cm².
Hydrogen permeability <1×10⁻¹⁰ mol/(m²·s·Pa).
l Lithium Battery Sintering Furnace Setter
Softening temperature >1700°C (no deformation under 20 kg load).
Multi‑layer stacking improves yield by 15%.
3. Optical & Medical Devices
l Laser Resonator Support Pillar
Thermal conductivity: 30 W/(m·K); temperature control ±0.1°C.
Low CTE ensures wavelength stability (Δλ/λ <10⁻⁶/°C).
l CT X‑ray Tube Insulator Base
Lead glass composite; ray shielding >95%.
Biocompatibility certified (ISO 10993‑5).
JiFeng-Keramik




