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Ceramic Dispensing Nozzle Manufacturer & Supplier - JiFeng-Keramik

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Ceramic Dispensing Nozzle

Our ceramic dispensing nozzles are made of high‑purity 99% Aluminiumoxid (Al₂O₃) or Y‑TZP zirconia (ZrO₂) Keramik. Inner diameter ranges from 0.01–2mm, surface finish Ra ≤0.1μm, designed for precision dispensing processes. With hardness ≥Hv1500, chemical resistance to solvents (acetone, alcohol, epoxy, usw.), and zero metal ion contamination, they are ideal for semiconductor packaging, LED die bonding, medical catheter bonding, and more. They solve common issues with metal or plastic nozzles: uneven dispensing, stringing, clogging, tragen, and swelling.

  • Produktdetails
  • Technische Spezifikationen

Kernvorteile

✅ Nano‑Scale Dispensing Precision

Micro‑hole precision machining: Laser drilling + mirror inner polishing (Ra ≤0.05μm), hole tolerance ±0.003mm. Supports ultra‑micro dispensing at 0.01ml/min with ±1% accuracy.

Non‑stick inner wall: Low surface energy reduces adhesive residue, prevents UV glue/silicone curing and clogging. Continuous service life >1000 Std..

✅ Extreme Durability

Wear & erosion resistance: Hardness 8× that of stainless steel. Resists high‑viscosity conductive glue with glass/silver powder; service life 10× longer.

Chemical resistance: Withstands strong acid (phosphoric acid), alkali (IPA), and 180°C high‑temp adhesive. No swelling or deformation for long‑term stability.

✅ Versatile & Compatible Design

Optimized tapered flow channel: 15°/30°/60° taper options for all fluid viscosities (water‑like UV glue to paste epoxy), reduces bubbles and turbulence.

Universal quick‑fit compatibility: Works with Nordson EFD, Musashi, ICH&J, and other leading dispensers (thread / snap / Luer lock), plug‑and‑play.

✅ Clean & Contamination‑Free

Medical‑grade safety: ISO 10993 biocompatibility certified, no particle shedding, suitable for medical catheter bonding and microfluidic chip packaging.

Non‑magnetic & insulating: No interference with precision electronics, ideal for magnetic levitation dispensers and high‑sensitivity sensor production.

Anwendungen

Semiconductor chip packaging

LED die bonding

Medical device assembly & catheter bonding

Microfluidic chip packaging

SMT & electronic assembly

High‑precision adhesive dispensing

Custom Service

Custom inner diameter, length, taper angle

Custom interface (thread, Luer lock, snap‑fit)

Drawing customization & sample approval

Fast quotation & short lead time

Performance ItemDetails
Material99% Al₂O₃ (standard), YTZP ZrO₂ (high toughness)
Inner Diameter0.01–2mm (micro/standard/highflow)
Temperature Range-40°C to 300°C (transient 500°C)
Bending Strength≥400MPa (Al₂O₃); ≥1200MPa (ZrO₂)
CertificationsIPC JSTD004, ISO 13485

 

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