Alumina Ceramic Screws

Key Manufacturing Technologies

1. Precision Forming & Thread Machining

Isostatic Pressing

Minimum size: M1.0×3 mm (hex socket / cross / slotted head customizable)

Thread accuracy: ISO 4H (zero‑clearance fit with metal nuts)

Laser‑Assisted Machining

Fine thread: pitch 0.25 mm, thread depth >0.5 mm (depth‑to‑diameter 5:1)

Anti‑slip serrated thread (pull‑out force +50%)

2. Material Toughening & Surface Treatment

Toughening Modification

3% Y₂O₃‑stabilized ZrO₂; fracture toughness up to 5.5 MPa·m¹ᐟ²

Surface Coatings

TiN coating: hardness HV2200, wear life ×8

Conductive Ni/Au coating: surface resistance <0.1 Ω·cm² for EMI shielding

Key Applications & Solutions

1. 半導体 & Vacuum Equipment

• Wafer Handling Fasteners

Low outgassing <5×10⁻¹⁰ Torr·L/s/cm²; UHV compatible (<10⁻⁸ Pa)

Static dissipative (10⁶–10⁹ Ω) to prevent particle adhesion

• Plasma Chamber Mounting

Resists Cl₂/CF₄ plasma (etch rate <0.05 μm/h)

Pre‑embedded FKM gasket (sealing pressure >10 MPa)

2. New Energy & High-Temp Equipment

• Fuel Cell Bipolar Plate Fasteners

Hydrogen‑embrittlement resistant (preload loss <5% after 1000 thermal cycles)

Conductive coating: contact resistance <2 mΩ·cm²

• Lithium Battery Sintering Furnace

Softening temp >1700℃; superior creep resistance vs metal bolts

Thermal shock: ΔT=1000°C air cooling >100 cycles

3. Medical & Optical Instruments

• MRI Non‑Magnetic Fasteners

Magnetic susceptibility <10⁻⁵; no imaging interference

ISO 10993‑5 biocompatibility certified

• Laser Module Assembly

CTE 6.5×10⁻⁶/°C (matches Mo/Kovar)

Low thermal conductivity (30 W/(m·K)) reduces thermal interference