Semiconductor Equipment Components -JiFeng Ceramics

Core Advantages Of Ceramic 半導体装置部品

Nanometer‑Level Precision

Flatness ≤0.005mm, 表面粗さRa≦0.1μm, ideal for wafer transfer & lithography alignment.

極限環境耐性

動作温度 800 ～ 1600°C; plasma & 耐酸性/耐アルカリ性 (pH 1 ～ 14); service life ×5+ vs metal.

Ultra-High Cleanliness

Metal ion leaching ≤1ppm; no particle shedding (NAS 1638 クラス 1); EUV & high-purity process compatible.

Excellent Thermal Management

AlN thermal conductivity ≥170W/m·K; CTE matches silicon (4.5×10⁻⁶/℃), reduces thermal stress.

代表的な用途 & Material Selection

1. Wafer Transport & サポート

ウェーハチャック

材料: アルミナ (Al₂O₃, purity ≥99.5%) or Silicon Carbide (SiC, purity ≥99.9%).
パフォーマンス: Electrostatic adsorption force ≥0.1MPa, flatness ≤0.003mm, compatible with thinning and bonding of 12-inch wafers.

Vacuum Chamber Flange

材料: 窒化アルミニウム (AlN, thermal conductivity ≥170W/m·K).
パフォーマンス: Gas tightness ≤1×10⁻⁹ Pa·m³/s, suitable for etching and PVD equipment.

2. Gas Distribution & Reaction Control

Gas Distribution Plate

材料: イットリア安定化ジルコニア (YSZ), resistant to plasma erosion.
パフォーマンス: Micropore diameter tolerance ±0.005mm, uniformity error ±2%.

Heater Base

材料: 炭化ケイ素 (SiC), temperature resistance up to 1600°C.
パフォーマンス: Resistance uniformity ≤±1%, designed for MOCVD epitaxial growth.

3. リソグラフィー & Inspection Equipment

EUV Optical Lens Base

材料: Low-expansion Invar Alloy, CTE ≤1×10⁻⁶/°C.
パフォーマンス: Thermal stability ±0.01μm/°C, compatible with processes below 7nm.

Wafer Alignment Stage

材料: Lightweight AlSiC ceramic composite.
パフォーマンス: Repeat positioning accuracy ±10nm, matches lithography focusing systems.

Why Partner with JiFeng Ceramics?

Material Selection

アルミナ / 窒化アルミニウム / 炭化ケイ素 / Special Alloys, compatible with diverse semiconductor process requirements.

プロセスの最適化

Precision grinding (tolerance ±0.001mm) and CVD coating for superior wear and plasma resistance.

機能統合

Embedded electrodes and sensors, matching intelligent temperature control and real-time monitoring systems.

コストメリット

Adopts domestic high-purity powder and machining technologies, 輸入ブランドよりも30%～50%安い価格でご提供します.

アイテム	詳細
セラミックス材料	Si₃N₄, Al₂O₃, ZrO₂, AlN, SiC
加工精度	±0.01mm; Flatness 0.003mm; Parallelism 0.005mm
Key Properties	Wear-resistant, high temp resistant, 高硬度, 絶縁, anti-corrosion
Colors	白, beige, black
カスタマイズ	Customizable per customer drawing