吉峰陶磁器
Core Advantages Of Black Zirconia Ceramic Structural Components for Semiconductor
Controllable Conductivity
Carbon/metal phase doping enables adjustable surface resistance from 10³–10¹⁰Ω, preventing electrostatic particle adsorption.
Ultra‑High Precision
CNC machining tolerance ±0.002mm, surface roughness Ra≤0.05μm, suitable for nanometer processes.
Plasma Corrosion Resistance
Corrosion rate <0.1μm/100h in fluorine/chlorine plasma environment; service life increased by 5×+.
Ultra‑High Cleanliness
No metal ion leaching; passes SEMI F47 particle shedding test (≤5 pcs/sheet @0.3μm).
Complex Structure Forming
Supports injection molding / 3D printing; thin‑wall (≥0.2mm), special‑shaped, and porous structures available.
Applications of Black Zirconia Ceramic Structural Components for Semiconductor
Semiconductor Frontend
- Etching: chamber liners, gas nozzles, wafer chucks
- Deposition (PVD/CVD): shield rings, bases, heater trays
- Lithography: mask holders, aligner parts
Display & Packaging
- OLED evaporation: light shields, robot grippers
- Probe stations: ceramic substrates, test sockets
- Advanced packaging: TSV insulation rings, RDL brackets
PV & エレクトロニクス
- PV coating: conductive rollers, guide rails
- High‑power devices: IGBT substrates, RF microwave windows
Why Choose Our Black Zirconia Structural Components?
Innovative Material Technology
Advanced material: reaction sintering + HIP, 99.5% density, uniform conductive phase. DLC coating: friction coefficient 0.1, wear resistance ×8.
Full-Process Quality Control
All items undergo helium leak testing (leak rate <5×10⁻¹⁰ Pa·m³/s) & X-ray inspection (≤10μm). SEM/EDS and plasma corrosion test reports are provided.
Fast Response System
15-day lead time for standard parts, 30 days for customized non-standard parts; rush orders available upon technical evaluation.
Global Technical Support
We provide FEA simulation optimization, failure analysis and equipment adaptation modification services.
