Black Zirconia Ceramic Structural Components for Semiconductor Manufacturer & Supplier

✅ Controllable Conductivity

Carbon/metal phase doping enables adjustable surface resistance from 10³–10¹⁰Ω, preventing electrostatic particle adsorption.

✅ Ultra‑High Precision

CNC machining tolerance ±0.002mm, surface roughness Ra≤0.05μm, suitable for nanometer processes.

✅ Plasma Corrosion Resistance

Corrosion rate <0.1μm/100h in fluorine/chlorine plasma environment; service life increased by 5×+.

✅ Ultra‑High Cleanliness

No metal ion leaching; passes SEMI F47 particle shedding test (≤5 pcs/sheet @0.3μm).✅ Complex Structure Forming

Supports injection molding / 3D printing; thin‑wall (≥0.2mm), special‑shaped, and porous structures available.

Semiconductor Frontend

Etching: chamber liners, gas nozzles, wafer chucks

Deposition (PVD/CVD): shield rings, bases, heater trays

Lithography: mask holders, aligner parts

Display & Packaging

OLED evaporation: light shields, robot grippers

Probe stations: ceramic substrates, test sockets

Advanced packaging: TSV insulation rings, RDL brackets

PV & エレクトロニクス

PV coating: conductive rollers, guide rails

High‑power devices: IGBT substrates, RF microwave windows

Advanced material: reaction sintering + HIP, 99.5% density, uniform conductive phase.

DLC coating: friction coefficient 0.1, wear resistance ×8.

Strict QC: 100% helium leak test, X‑ray inspection.

Fast delivery: standard 7 days, custom 15 days, urgent 72h.

Global support: FEA simulation, failure analysis, equipment adaptation.

Parameter	Details
材料	Yttriastabilized zirconia (3Y/5YZrO₂), black conductive zirconia (carbon/metal doped)
密度	6.0–6.2 g/cm³
硬度	1200–1400 HV
Bending Strength	≥1000 MPa (3point bending)
熱膨張係数	10.5×10⁻⁶/°C (20–400°C, matches stainless steel)
Surface Resistance	10³–10¹⁰ Ω (customizable)
Size Range	Max 300×300×150mm, thickness 0.2–50mm
Certifications	SEMI S2/S8, ISO 146441 Class 1, RoHS, UL 94 V0